Sicom was invited for China Bluetooth Product Summit Forum

2021-12-23 14:12:26

21st Dec 2021,「2021 (Winter) China Bluetooth Earphones Industry Summit Forum」was held in Shenzhen Exhibition Center, many earphone chipset factories, famous brands and assembly factories were gathering for earphone technology sharing and future discussion, to known earphone production chain present and future.


Shenzhen Sicom Digital Technology Co., Ltd was invited as a new rising brand and assembly vendor. Since year 2017 Sicom had entered TWS earbuds field, it keeps focusing on high price performance, high quality earphone products. No matter on design or solution, Sicom always keeps people oriented strategy and pursues customers’ satisfactions as its eternal goal. After all the efforts of Sicom staff, Sicom owes its own brand”RIOTCATS” which had entered domestic market gradually . To achieve “colorful life derived Sicom”mission, we persevere with“carefulness, efficiency, innovation,perfection”creation spirit and concentrate on fashion design, good quality and top experience products for customer and provide the top services.


Many experts from this industry had shared three phases of TWS earphone further development:

Phase 1: by year 2017 to 2018, to solve the unstable connection for the wireless beginning

Phase 2: by year 2019 to 2020, upgrade talk experience,promotion for ANC,ENC etc technology.

Phase 3: by year 2020 to 2021, TWS earphone will fully enhance sound quality and chip-set performance, low costs, a real fancy product for everyone.


Hence the few years after will be the break-through period,to enhance product features and to specify each market keep industry grasping profits and possessing market shares.